Current Location: Home > Introduction of LED
Introduction of LEDHome > Introduction of LED

Menu of LED



 

Summarize about LED
Summary about Production technique
History of LED
White light LED
Features of LED
Product classification
PFD of LED

Menu of LED
  LED(Light Emitting Diode),is a kind of solid semiconductor component, which can transform electricity into light directly. The heart of LED is a semiconductor chip, with was attached to an holder ,including a negative pole and the other end attached to the positive pole of the battery. The whole chip is wrapped by ethoxyline resin. The semiconductor chip is made up of 3 components. P-type semiconductor, which occupied most of the place in the whole ;the N-type semiconductor, where the electron stays .There are usually 1 to 5quantum wells between the two chips .when current flow pass though the the wire ,the electron and the hole were pushed to the quantum wells, and recombined with the hole there , emitting energy in the form of photons. This is The principle of light-emitting. And the colour of the light ,thus the wavelength of the light ,was determined by the material of the P-N junction.

Summary about Producing techniques
  Light Emitting Diode, short for LED, is a kind of solid semiconductor component, which can transform electricity into light directly. The heart of LED is a semiconductor chip, with was attached to an holder ,including a negative pole and the other end attached to the positive pole of the battery. The whole chip is wrapped by ethoxyline resin. The semiconductor chip is made up of 3 components. P-type semiconductor, which occupied most of the place in the whole ;the N-type semiconductor, where the electron stays . The two kinds of semiconductors combined into a P-N junction. when current flow pass though the wire, the electrons were pushed to the P-area, and recombined with the hole there , emitting energy in the form of photons. This is The principle of light-emitting .This is a kind of display mode via controlling of the semiconductor diode.

  LED epitaxial wafer process flow
  Over the last decade, all the world had been sparing no efforts in order to develop Blue-ray High-Brightness LED .And the application of Commercial product such as Blue and green light emitting diode and Laser Diode(LD) has shown the latent potential of the III-V group elements. Among the current Commercial material and epitaxy technology, Liquid phase epitaxy growth method was mainly used in producing Blue and green light emitting diodes.

   While Vapor phase epitaxy growth method was mainly used in producing Yellow and orange light-emitting diodes, with gallium, As and P as the main material .

  Generally speaking , the growth of GAN needs a high temperature to break the bonds between Nitrogen and hydrogen in the molecule of ammonia, on the other aspect ,we know it that t ammonia will react with MO Gas and produce a kind of by production without volatility though dynamics simulation.

Details of LED epitaxial wafer process flow
  Substrate - structural design - the buffer layer growth - N-type Gan layer growth - multi-quantum well light-emitting layer of Health - P-type Gan layer growth - annealing - testing (ray fluorescence, X-ray) - epitaxial films
  Epitaxial film - design, processing mask Edition - lithography - Ion Etching - N-type electrode (coating, annealing, etching) - P-type electrode (coating, annealing, etching) - Dicing - chip sorting, sub – Class

Specifically described as follows:
  Fixation: fix the single Cristal Silicon rod on the working bench
  Wafer cutting: Cut the single Cristal Silicon rod into slices with Precise geometry size. Wash off the ganister sand that may emerge。